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2309409-1
Memory Socket DDR4 SODIMM 260P 5.2H STD | TE Connectivity 2309409-1
Availability: In Stock
CAD Models: Symbol, Footprint, 3D Model
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| Verification | Issues | Specs | Pricing |
Specifications for the 2309409-1
| Part Name | 2309409-1 |
| Manufacturer | TE Connectivity |
| Category | Connectors |
| Centerline (Pitch) | .129 |
| Keying | Standard |
| Circuit Application | Power |
| Ejector Location | Both Ends |
| Housing Material | High Temperature Thermoplastic |
| Retention Post Location | Both Ends |
| Center Post | Without |
| Number of Positions | 260 |
| PCB Mount Retention Type | Solder Peg |
| Profile | Low |
| PCB Mount Retention | With |
| Center Key | Offset Left |
| TE Internal Number | 2309409-1 |
| Connector & Contact Terminates To | Printed Circuit Board |
| Connector System | Cable-to-Board |
| Ejector Type | Locking |
| Housing Color | Black |
| Insertion Style | Cam-In |
| Sealable | No |
| Connector Mounting Type | Board Mount |
| Number of Keys | 1 |
| Operating Temperature Range | -55 – 85 |
| 列数 | 2 |
| Packaging Method | Tape & Reel |
| Packaging Quantity | 800 |
| DRAM Type | Small Outline (SO) |
| Contact Mating Area Plating Material | Gold Flash |
| Socket Style | SO DIMM |
| Module Key Type | Offset Left |
| PCB Mounting Style | Surface Mount |
| Contact Base Material | Copper Alloy |
| Module Orientation | Right Angle |
| SGRAM Voltage (V) | 1.2 |
| Socket Type | Memory Card |
| Stack Height | 5.2 |
| Latch Material | High Temperature Thermoplastic |
| Row-to-Row Spacing | 8.2 |
| Contact Current Rating (Max) (A) | .5 |
| DRAM Voltage (V) | 1.2 |
| Product Type | Socket |
| UL Flammability Rating | UL 94V-0 |
| PCB Contact Termination Area Plating Material | Gold Flash |
| Formats Available for Symbols and Footprints |
Altium, Eagle, KiCAD, Cadence OrCad/Allegro, PADS, DxDesigner, PCB123, Pulsonix, Proteus |
| Datasheet | See Datasheet PDF |
Inventory for the 2309409-1 by TE Connectivity AMP Connectors from major distributors.
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