Wrong footprint for the MCP2562FD-H/MF
The footprint is for the SOIC package and not the 8-DFN. The first giveaway is that there is no exposed center pad.
Added 1 year, 8 months ago.
3 Answers
Hello there!
Thanks for reaching out and flagging this! We've raised this issue to our engineering team and will come back with an update!
Regards,
Antonio.
Answered 1 year, 8 months ago.
Ron here, stepping in for Antonio.
The footprint for this part was linked to this part page through an algorithm based on the package details, so it wasn’t verified against the datasheet. Rest assured that we are working on making this algorithm more precise.
That said, our team has now updated the footprint for this component. You may download it again and use it in your designs.
Let me know if you have any questions.
Regards,
Ron
Answered 1 year, 8 months ago.
Much better!
Answered 1 year, 8 months ago.